JOB DESCRIPTION*

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.

Nature of Work:

Develops, evaluates, revises, and maintain hybrid Microcircuit assembly processes and documentation including: epoxy or eutectic solder attachment of die, substrate, and carriers into hermetic module housings, cleaning processes such as solvent and RF plasma. Maintain and develop thermo-compression and thermosonic, wire bond schedules for various materials and manual and automated wire bonders. Inspect in-process hardware for conformance to Mil-Std visual inspection criteria and troubleshoot problems with processes as needed. Assist in troubleshooting DC/RF performance problems related to assembly processes and recommend solutions. Diagnose problems related to laser sealing and the hermeticity of module assemblies, the manufacturing of housings, and the various machined/plated hardware used in RF assemblies. Program die attach Machine, Wire bonder and plasma cleaners. Design tooling and fixtures needed for assembly operations. Provide recommendations to manufacturing engineering, management, and customers regarding assembly processes and operation flow. Provide technical support to production Assembly and Test technicians.

Responsibilities:

- Create Travelers for Microelectronics Assemblies and Test

- Create MPIs for Microelectronics Assemblies and Test

- Review daily Manufacturing issues and resolve

- Learn Programming and set up of MRSI di-attach machine and Auto-bonder.

Qualification Requirements:

-BS in Engineering Discipline with minimum 1 years of experience or equivalent in supporting manufacturing of electronic Assemblies

- Experience in creating Manufacturing Travelers

- Ability to Learn Programming and Set up Auto bonder and Die attach machines, Plasma Cleaner

- Experience Process development

- Proficiency in computer skills and programming

- Good communication skills, must interface well with internal and external customers.

- Experience in Resolving daily Manufacturing issues on Manufacturing Floor

- Experience in Reviewing and resolving Daily Test issues on Manufacturing Floor

- Experience with IPC-A-610, MIL- STD-883 or Equivalent STD, AS9100

Sanmina is an Equal Opportunity Employer - M/F/Veteran/Disability/Sexual Orientation/Gender Identity

This is an ITAR facility and applicant must be a US Citizen or a lawful permanent resident.

Salary Range(annual): $70,000 - $88,000

In addition, Sanmina Providesa variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.